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The electrostatic-alloy bonding technique used in MEMS

WANG Wei, CHEN Wei-ping

Frontiers of Mechanical Engineering 2006, Volume 1, Issue 2, Pages 238-241 doi: 10.1007/s11465-006-0011-5

Abstract: Electrostatic-alloy bonding of silicon wafer with glass deposited by Au to form Si/Au-glass water, andbonding of Si/Au-glass with silicon wafer were researched during fabrication of pressure sensors.then Si-Au alloy bonding was formed by annealing at 400vH for 2 h.The results indicate that large bond strength was obtained at the bonding interface.This process was used in fabricating a pressure sensor with a sandwich structure.

Keywords： Si/Au-glass strength MEMS packaging process sandwich structure

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Damage mode and failure mechanism of starch based API gluelam bonding

Shi Junyou,Xu Wenbiao and Wang Shumin

Strategic Study of CAE 2014, Volume 16, Issue 4, Pages 40-44

Abstract:

The starch- based aqueous polymer isocycante（API）gluelam bonding as theresearch object，with tensile shear strength as a key evaluation index，accelerated aging tests on gluelam bondingto study damage mode and failure mechanism of the bonding The results show that：the adhesive fractureproperties of ductile fracture structure，and with the increase of aging time，the damage mode of thebonding transforms form cohesion damage mode to the integrated mode of cohesion damage and interface

Keywords： bonding structure accelerated aging fracture character damage mode

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Performance of steel bridge deck pavement structure with ultra high performance concrete based on resinbonding

Frontiers of Structural and Civil Engineering 2021, Volume 15, Issue 4, Pages 895-904 doi: 10.1007/s11709-021-0759-z

Abstract: Through FEM analysis and static and dynamic bending fatigue tests of the composite structure, the influencesThe results show that the resin bonded UHPC pavement structure can reduce the weld strain in the steelThe EP bonding layer can nearly double the drawing strength of the pavement interface from 1.3 MPa, andimprove the bending resistance of the UHPC structure on steel bridge decks by about 50%; the bendingdeflection of the UHPC pavement structure increases exponentially with increasing fatigue load.

Keywords： steel bridge deck pavement ultra-high-performance concrete epoxy resin composite structure bending

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Ultraviolet exposure enhanced silicon direct bonding

Guanglan LIAO, Xuekun ZHANG, Xiaohui LIN, Canghai MA, Lei NIE, Tielin SHI,

Frontiers of Mechanical Engineering 2010, Volume 5, Issue 1, Pages 87-92 doi: 10.1007/s11465-009-0078-x

Abstract: the traditional wet chemical activation processes, is applied to enhance hydrophilic silicon direct bondingThe effects of UV exposure on silicon wafers’ nano-topography and bonding strength are studied.The correlations of annealing temperature and annealing time vs. bonding strength are experimentallyResults indicate that the bonding strength increases sharply then gently with increasing annealing temperatureIt follows from the results that the bonding strength of silicon wafer pairs with UV exposure decreases

Keywords： ultraviolet (UV) exposure silicon direct bonding bonding strength reliability

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Patterned wafer bonding using ultraviolet adhesive

Rui ZHUO, Guanglan LIAO, Wenliang LIU, Lei NIE, Tielin SHI

Frontiers of Mechanical Engineering 2011, Volume 6, Issue 2, Pages 214-218 doi: 10.1007/s11465-011-0130-5

Abstract:

The process of patterned wafer bonding using ultraviolet (UV) adhesive as the intermediate layer wasappropriate pre-drying temperature (60°C), and predrying time (6 min), we obtained the intermediate layer bondingExperimental results indicate that patterned wafer bonding using UV adhesive is achieved under room temperaturehas advantages of easy operation, low cost, and no plugging or leakage in the patterned area after bondingPatterned wafer bonding using UV adhesive will have great potential in the fabrication of microfluidic

Keywords： ultraviolet (UV) adhesive intermediate layer patterned wafer bonding

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A space solar cell bonding robot

FU Zhuang, ZHAO Yan-zheng, LIU Ren-qiang, DONG Zhi

Frontiers of Mechanical Engineering 2006, Volume 1, Issue 3, Pages 360-363 doi: 10.1007/s11465-006-0027-x

Abstract: A space solar cell bonding robot system which consists of a three-axis Cartesian coordinate s robot,coating device, bonding device, orientation plate, and control subsystem was studied.

Keywords： Cartesian coordinate thickness three-axis Cartesian orientation control subsystem

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Towards Cr(VI)-free anodization of aluminum alloys for aerospace adhesive bonding applications: A review

Shoshan T. Abrahami, John M. M. de Kok, Herman Terryn, Johannes M. C. Mol

Frontiers of Chemical Science and Engineering 2017, Volume 11, Issue 3, Pages 465-482 doi: 10.1007/s11705-017-1641-3

Abstract: Although different acids can be used to create this type of structure, the excellent adhesion and corrosion

Keywords： aluminum Cr(VI)-free surface pre-treatments anodizing adhesive bonding

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ARC welding method for bonding steel with aluminum

Zhenyang LU, Pengfei HUANG, Wenning GAO, Yan LI, Hanpeng ZHANG, Shuyan YIN

Frontiers of Mechanical Engineering 2009, Volume 4, Issue 2, Pages 134-146 doi: 10.1007/s11465-009-0033-x

Abstract: When welding steel with aluminum, the appearance of intermetallic compounds of Fe and Al will decrease tenacity and increase rigidity, which leads to bad joint performance. A new type of low energy input (LEI) welding technology is introduced which can be used to weld steel with aluminum. Using the technology, brazing was located on the steel side and arc fusion welding on the aluminum side. The less heat input reduces the thickness of intermetallic compounds to 3-4 μm. Tensile strength tests prove that the joint breaks at the heat-affected zone and the strength is higher than 70% of the aluminum’s. Thus, the method can lead to a good performance joint.

Keywords： joining of steel and aluminum low energy input welding arc welding fusion welding – brazing

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Packaging of Micro Electro Mechanical Systems Based on Bulk Silicon Bonding and Film Sealed Technology

Wang Weiyuan,Wang Yuelin

Strategic Study of CAE 2002, Volume 4, Issue 6, Pages 56-62

Abstract: It is based on bulk silicon bonding technology and film sealed technology.The bulk silicon bonding technology includes electrostatic bonding, silicon direct bonding and interfaciallayer assisted bonding.

Keywords： packaging of MEMS bulk silicon bonding technology film-sealed technology

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Hyperbranched magnetic polymer: highly efficient removal of Cr(VI) and application in electroplating wastewater

Frontiers of Chemical Science and Engineering 2023, Volume 17, Issue 10, Pages 1568-1580 doi: 10.1007/s11705-023-2303-2

Abstract: Additionally, surface electrostatic adsorption, reduction effects, and the spherical polymer structure

Keywords： magnetic polymer chromium removal hydrogen bonding recyclability actual wastewater

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Thermal transport properties of monolayer phosphorene: a mini-review of theoretical studies

Guangzhao QIN, Ming HU

Frontiers in Energy 2018, Volume 12, Issue 1, Pages 87-96 doi: 10.1007/s11708-018-0513-y

Abstract: this mini-review, the unique thermal transport properties of phosphorene induced by the hinge-like structureIt is found that the (vdW) interactions play a key role in the formation of resonant bonding, whichinto account of the vdW interactions and including the long-ranged interactions caused by the resonant bondingMoreover, a fundamental insight into the thermal transport is provided based on the review of resonant bonding

Keywords： thermal transport phosphorene resonant bonding

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Influence of pore structure on biologically activated carbon performance and biofilm microbial characteristics

Frontiers of Environmental Science & Engineering 2021, Volume 15, Issue 6, doi: 10.1007/s11783-021-1419-1

Abstract:

• Pore structure affects biologically activated carbon performance.

Keywords： Granular activated carbon Biologically activated carbon filter Bacterial community structure Porestructure

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Hierarchical fractal structure of perfect single-layer graphene

T. Zhang, K. Ding

Frontiers of Mechanical Engineering 2013, Volume 8, Issue 4, Pages 371-382 doi: 10.1007/s11465-013-0279-1

Abstract:

The atomic lattice structure of perfect single-layer graphene that can actually be regarded as a kindof hierarchical fractal structure from the perspective of fractal geometry was studied for the firstThree novel and special discoveries on hierarchical fractal structure and sets were unveiled upon examinationThe interior fractal-type structure was discovered to be the fifth space-filling curve from physicalA fundamental example of a multi-fractal structure was also presented.

Keywords： hierarchical fractal structure fractal dimension the fifth space-filling curve multi-fractal structure

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Novel 1,2,3-triazole-based compounds: Iodo effect on their gelation behavior and cation response

Yaodong Huang, Shuxue Liu, Zhuofeng Xie, Zipei Sun, Wei Chai, Wei Jiang

Frontiers of Chemical Science and Engineering 2018, Volume 12, Issue 2, Pages 252-261 doi: 10.1007/s11705-017-1683-6

Abstract: reference compound ( ) suggests that there are intermolecular and intramolecular non-classical hydrogen bondingbetween the two series of compounds results from the iodo effect and implies the existence of halogen bonding

Keywords： organogelator 1 2 3-triazole derivatives self-assembly halogen bonding cation response

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Floating forest: A novel breakwater-windbreak structure against wind and wave hazards

Frontiers of Structural and Civil Engineering 2021, Volume 15, Issue 5, Pages 1111-1127 doi: 10.1007/s11709-021-0757-1

Abstract: A novel floating breakwater-windbreak structure (floating forest) has been designed for the protectionThe modular arch-shaped concrete structure is positioned perpendicularly to the direction of the prevailingThe structure below the water surface acts as a porous breakwater with wave scattering capability.

Keywords： floating structure breakwater windbreak hydrodynamic CFD